Visions and Latest Developments in Dynaform

DYNAFORM has been evolved from a Draw Die analysis tool to a Die System analysis tool kits. As the simulation technology and computer resources have been growing rapidly, more demands emerges from different stage of the product and process development sector. Stamping simulation technology is facing more challenges. Based on LS- DYNA ® implicit and explicit solver, DYNAFORM provide simulation tools that support not only the incremental analysis for validation of Draw Die face design, also provides an one-step analysis based cost estimating tool (BSE), Die Face Design tool (DFE) and Die structure analysis, motion transfer and scrap shedding Analysis. DYNAFORM helps the product and process development cycle and makes them more efficient and reliable. Evolving into a process based simulation tool is the future of DYNAFORM. Upgrading the user interface to be flexible for customization and supporting script function are the focus of the next generation DYNAFORM. This paper will also discuss our visions and the future development of DYNAFORM.