MPP in Stamping Simulations with LS-DYNA

With the continuous improvement of MPI protocols, for example, Lam-MPI, MPICH, etc.., even fast computer hardware and network connections, the applications of MPP technologies in multi-stage stamping simulations for auto industries becomes more and more attractive, not only because of their scalability, but also for their ability to re-use the older equipments without sacrifice the speed of simulations. In this paper, we will present our study results on the MPP version of LS-DYNA in our stamping simulations and our ultimate goal with this technology. Nowadays, in order to reduce operation costs and maintain high quality of products, FEA simulations of stamping processes become de-facto in the auto industries. With the continuous improvement of FEA technology and computer hardware, numerical simulations of multi-stage stamping operations have become a reality. Because the deliverability of simulations is one of our five major quality measurements, we need even faster simulation speed to catch up with new product style changes.