Drop Simulation for Portable Electronic Products

The portable electronic devices are becoming smaller and lighter in recent years, and hence these products are easily damaged under the drop and impact conditions. Traditionally, manufacturers must have lots of mockups and samples to simulate the impact behavior through experiment. To minimize the development period and the try-and- error costs, ODMs in Taiwan begin to predict the impact behavior by LS-DYNA. For ODMs who want to establish CAE capability, there are two main challenges: (1) First challenge is to determine the opportune moment to introduce the CAE tools, which also implies the traditional design flow should be rearranged. (2) The maximum dimension of portable electronic devices is usually less than 30 cm, so mechanism features are relative small and difficult to build up a complete FEM model. The main theme of this present is to provide a prediction about drop behavior of the portable electronic products in the early design stage and verified with the experiment.