Die Attach Process using Adaptive ISPG in LS-DYNA

The die-attach process is a crucial step in electronic packaging, where semiconductor chips (dies) are securely bonded onto substrates (e.g., lead frames or printed circuit boards). The process typically in-volves applying an adhesive or solder material to join the die and substrate. It ensures electrical con-nectivity, dissipates heat, and protects the delicate semiconductor components. Precise die-attach (DA) techniques are vital to guaranteeing the reliability and performance of electronic devices, as improper bonding can lead to connection failures and reduced overall functionality of the packaged components.