Introduction of ISPG Method and Geometric Multiscale Modeling for Electronics Solder Reflow and Shock Wave Analysis

Solder joints have become the main mechanical and electrical connections in modern microelectronics packaging for most consumer electronics products and they are typically observed to be the weakest links in terms for structural strength in the drop shock event. A drop shock simulation involves modeling the shock wave effect on mesoscale solder joints and macroscale chip packages concurrently, which is a typical multi-scale problem. Conventional finite element approaches using beam elements for the representation of the solders and the one-way sub-modeling technique cannot offer a high-fidelity solution. In addition, the shape of the solder ball is a very important contributory factor in determining the local stress levels and it is impractical to obtain all solder ball geometries by experimental measurement. Therefore, an effective simulation tool for the prediction of solder ball shape in the solder joint design as well as for the drop shock analysis is required in electronics industry.