Modelling of Bonded Component Tests, Comparing MAT_240 to State of the Art Models

Modelling of adhesively bonded joints is still an active field of research, aiming for a more accurate description and simpler calibration processes without significant increase in computational costs. There are two different approaches typically applied to model adhesives depending on the size of the problem and required accuracy. For smaller problems where the computational cost is of less relevance, the adhesive line can be finely discretized and modelled with a mesoscopic material model. This mesoscopic model is characterized by a constitutive law describing the relation between stresses and strains in the material.